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Características generales Samsung Galaxy S10 SM-G973 (Samsung SM-G973F/DS (Global); SM-G973U (USA); SM-G973W (Canada); SM-G9730 (China)) declaradas por el fabricante. Las imágenes de alta resolución de la placa base y los componentes electrónicos.


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Technical review Samsung Galaxy S10 SM-G973

Main and additional circuit boards Samsung Galaxy S10 SM-G973

Side 1
Side 2
Characteristics
Features
Type
Smartphone
OS
Android 9.0 (Pie)
SIM type/size
Nano SIM
SIM
Single SIM or Dual SIM
Dimensions
149.9 x 70.4 x 7.8 mm (5.90 x 2.77 x 0.31 in)
Weight
157 g (5.54 oz)
Display
Display type
Dynamic AMOLED
Size
6.1 inches
Resolution
1440 x 3040 pixels, 19:9 ratio
PPI density
550
Protection
Corning Gorilla Glass 6
Multimedia
Main camera
12 MP/ 12 MP/ 16 MP
Main camera Video
2160p, 30fps
Front (selfie) camera
10 MP
Front (selfie) camera Video
2160p, 30fps
Audio
MP3, AAC, WAV, WMA, FM-radio
Headphone jack
Mini jack 3.5 mm
Network
Technology
GSM/3G/4G LTE
LTE
Band 1, 2, 3, 4, 5, 7, 8, 12, 13, 17, 18, 19, 20, 25, 26, 28, 32, 38, 39, 40, 41, 66
Interfaces
Wi-Fi 802.11 a/b/g/n/ac/ax, dual-band, Wi-Fi Direct, hotspot. Bluetooth 5.0, A2DP, LE, aptX
Satellite navigation
A-GPS, GLONASS, BDS, GALILEO
Processor and Memory
System on a chip
Samsung Exynos 9820
CPU
Octa-core 2x Mongoose M4 2.73 GHz+ 2x Cortex-A75 2.31 GHz + 4x Cortex-A55 1.95 GHz
GPU
Mali-G76 MP12
Internal memory
512 GB
RAM
8 GB
Card slot
Micro SD, up to 512 GB (uses shared SIM slot)
Battery
Battery capacity
Li-Ion 3400 mAh
Charging port
USB Type-C 3.1
Other
Announced
2019, February

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Basándonos en nuestra experiencia, hicimos una selección de las fallas más comunes de los dispositivos móviles y evaluamos la dificultad de realizar reparaciones para cada uno de ellos. La evaluación final de la dificultad de la reparación es la suma de todos los parámetros. Esta clasificación de dificultad también se aplica a todos los modelos Samsung Galaxy S10 SM-G973 — Samsung SM-G973F/DS (Global); SM-G973U (USA); SM-G973W (Canada); SM-G9730 (China) lanzados para mercados en diferentes países.




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