We recommend using a special heating device such as a separator machine, heat gun, or heating mat. It will simplify the process. You can use a home hairdryer, but you will have to make a nozzle by hand or have a suitable one in the kit to gently heat and concentrate the heat flow in the right place.
âšī¸ī¸ The surface of the back cover must be heated to soften the adhesive underneath. The approximate heating temperature is 50° C / 125° F.
Use a thin plastic film or pick for separation. To facilitate the process, you can use isopropyl alcohol. It is often the most difficult to pass the tool between the parts to be divided. Choose the far edge from the FFC cables or buttons.
Do not use a lever or any force for separation that could damage the elements inside.
â ī¸ī¸ Pay attention to the fingerprint sensor cable! The cable connects the fingerprint sensor on the back cover to the motherboard.