Disassembly/Repair of the mobile device Sony Xperia XA2 Plus (Sony Xperia XA2 Plus H4413) with each step description and the required set of tools.

⚠ Before disassembling, do not forget to turn your phone off.

Open the hatch hiding the tray of the SIM and Memory cards (Micro SD), and remove it.

We recommend using a special heating device such as a separator machine, heat gun, or heating mat. It will simplify the process. You can use a home hairdryer, but you will have to make a nozzle by hand or have a suitable one in the kit to gently heat and concentrate the heat flow in the right place.

ℹ️ The surface of the back cover must be heated to soften the adhesive underneath. The approximate heating temperature is 50° C / 125° F.

Use a thin plastic film or pick for separation. To facilitate the process, you can use isopropyl alcohol. It is often most difficult to pass the tool between the parts to be divided. Choose the far edge from the FFC cables or buttons.

Do not use a lever or any force for separation that could damage the elements inside.

Pry up the fingerprint sensor connector and remove the cover.

Using a screwdriver (Phillips 1.5 mm PH000), unscrew five screws.

Remove the cover with antennas that protect the printed circuit board (PCB). Try to lift the covers by the edges and not push anything between them to not accidentally touch or short-circuit anything on the PCB.

Disconnect the battery connector as soon as possible.

ℹ️ The Sony Xperia XA2 Plus H4413 model has a battery LIP1653ERPC with 3580 mAh capacity (aka rechargeable battery).

⚠ It is highly recommended to disconnect the connector to avoid possible short circuits during disassembly.

Also, try not to use a metal tool to disconnect the rechargeable battery connector or do it carefully.

Using a screwdriver (Phillips 1.5 mm PH000), unscrew four screws.

Remove the loudspeaker assembly with antennas.

Disconnect the coaxial cable connector, cable to the mainboard, and vibration motor wires connector on the daughterboard.

⚠ Do not pull on the cable or pry it with a sharp tool, the connectors are pretty weak and break easily, or the cable falls out of the end (lug).

Remove the sub-board. It is glued to the frame with metalized tape, so to facilitate the process, the board can be heated a bit.

ℹ️ The board contains a charging port (Micro USB), microphone, spring contacts for the speaker, and an antenna unit.

⚠ It is not necessary to insert the tool under the board when removing the sub-board. Internal components could be damaged.

Pry up the connectors and remove the front (selfie) and rear cameras.

Pry up the connectors of the display module cable, inter-board cable, and two coaxial cables.

Using a screwdriver (Philips 1.5 mm PH000), unscrew one screw, pry up the connector and remove the headphone jack socket.

Using a screwdriver (Philips 1.5 mm PH000), unscrew one screw securing the motherboard.

Carefully remove the printed circuit board. There is no need to use a lever or try to reach the board by force. Make sure that nothing is getting in the way or holding the board.

⚠ Do not bend the circuit board when removing it or push tools under it. Unbeknownst to yourself, you can damage components or cables from the inside.

ℹ️ In the display frame remained: the earpiece speaker, battery, coaxial cables, and vibration motor.