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Use the ejection tool (aka Needle) or Paperclip. Push the tip all the way into the hole until the tray ejects, and then pull the tray of SIM and Memory card (Micro SD) out.
â ī¸ Pay attention! The tool must be inserted into a hole on the edge of the phone's housing. Do not press too hard. It may break the tray eject mechanism.
We recommend using a special heating device such as a separator machine, heat gun, or heating mat. It will simplify the process. You can use a home hairdryer, but you will have to make a nozzle by hand or have a suitable one in the kit to gently heat and concentrate the heat flow in the right place.
âšī¸ī¸ The surface of the back cover must be heated to soften the adhesive underneath. The approximate heating temperature is 50° C / 125° F.
Use a thin plastic film or pick for separation. To facilitate the process, you can use isopropyl alcohol. It is often most difficult to pass the tool between the parts to be divided. Choose the far edge from the FFC cables or buttons.
Do not use a lever or any force for separation that could damage the elements inside.
Remove the cover with an NFC tag and antennas that protect the printed circuit board (PCB). Try to lift the covers by the edges and not push anything between them to not accidentally touch or short-circuit anything on the PCB.
Disconnect the battery connector as soon as possible.
âšī¸ī¸ The Xiaomi Mi 9 model has a battery BM3L with 3200 mAh capacity (aka rechargeable battery).
â ī¸ It is highly recommended to disconnect the connector to avoid possible short circuits during disassembly.
Also, try not to use a metal tool to disconnect the rechargeable battery connector or do it carefully.
Disconnect the connector on the motherboard, and remove the front (selfie) camera.
Pry up the connectors of the display module cable, inter-board cable, and two coaxial cables.
â ī¸ Be careful when removing the cables from the connectors, the cables are pretty thin, and it is easy enough to break them or damage the contact tracks inside.
Carefully remove the printed circuit board. There is no need to use a lever or try to reach the board by force. Make sure that nothing is getting in the way or holding the board.
â ī¸ Do not bend the circuit board when removing it or push tools under it. Unbeknownst to yourself, you can damage components or cables from the inside.
Carefully, preferably from the edge, disconnect the connector and remove the inter-board cable connecting the mainboard to the daughterboard (also known as the sub-board).
â ī¸ Be careful when removing the cables from the connectors, the cables are pretty thin, and it is easy enough to break them or damage the contact tracks inside.
âšī¸ī¸ An arrow on the FFC cable (flexible flat cable) indicates its correct position.
Remove the sub-board. It is glued to the frame with metalized tape, so to facilitate the process, the board can be heated a bit.
âšī¸ī¸ The board contains a charging port (Micro USB), microphone, spring contacts for the speaker, vibration motor, and an antenna unit.
â ī¸ It is not necessary to insert the tool under the board when removing the sub-board. Internal components could be damaged.
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