General characteristics Highscreen Blast declared by the manufacturer. The high-resolution pictures of the motherboard and electronic components.


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Technical review Highscreen Blast

Main and additional circuit boards Highscreen Blast

Side 1
Side 2
Characteristics
Features
Type
Smartphone
OS
Android 4.0 (Ice Cream Sandwich)
SIM type/size
Mini SIM
SIM
Dual SIM
Dimensions
67 x 131 x 9.9 mm (2.63 x 5.15 x 0.38 in)
Weight
145 g (5.11 oz)
Display
Display type
IPS LCD
Size
4.5 inches
Resolution
540 x 960 pixels, 16:9 ratio
PPI density
245
Protection
- - -
Multimedia
Main camera
8 MP
Main camera Video
720p, 15 fps
Front (selfie) camera
2 MP
Front (selfie) camera Video
- - -
Audio
MP3, AAC, WAV, WMA, FM radio
Headphone jack
Mini jack 3.5 mm
Network
Technology
GSM/ 3G
LTE
No
Interfaces
Wi-Fi 802.11n, Bluetooth 3.0
Satellite navigation
GPS
Processor and Memory
System on a chip
Qualcomm MSM8225 Snapdragon S4 Play
CPU
Dual-core Cortex-A5 1.2 GHz
GPU
Adreno 203
Internal memory
4 GB
RAM
768 MB
Card slot
Micro SD, up to 32 GB (dedicated slot)
Battery
Battery capacity
Li-Ion 2000 mAh
Charging port
Micro USB
Other
Announced
2013

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Based on our experience, we made a selection of the most common malfunctions of mobile devices and evaluated the difficulty of performing repairs for each of them. The final evaluation of the difficulty of the repair is the sum of all the parameters. This difficulty rating is also applicable for all models Highscreen Blast released for markets in different countries.



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