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General characteristics Philips Xenium W732 declared by the manufacturer. The high-resolution pictures of the motherboard and electronic components.


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Technical review Philips Xenium W732

Main and additional circuit boards Philips Xenium W732

Side 1
Characteristics
Features
Type
Smartphone
OS
Android 4.0 (Ice Cream Sandwich)
SIM type/size
Mini SIM
SIM
Dual SIM
Dimensions
126.4 x 67.3 x 12.3 mm (4.98 x 2.65 x 0.48 in)
Weight
168.9 g (5.93 oz)
Display
Display type
IPS LCD
Size
4.3 inches
Resolution
480 x 800 pixels, 5:3 ratio
PPI density
217
Protection
- - -
Multimedia
Main camera
5 MP
Main camera Video
480p, 30fps
Front (selfie) camera
0.3 MP
Front (selfie) camera Video
- - -
Audio
MP3, AAC, FM radio
Headphone jack
Mini jack 3.5 mm
Network
Technology
GSM/ 3G
LTE
No
Interfaces
Wi-Fi 802.11n, Bluetooth 2.1
Satellite navigation
GPS with A-GPS
Processor and Memory
System on a chip
MediaTek MT6575
CPU
Cortex-A9 1.0 GHz
GPU
PowerVR SGX531
Internal memory
4 GB
RAM
512 MB
Card slot
Micro SD, up to 32 GB (dedicated slot)
Battery
Battery capacity
Li-Ion 2400 mAh
Charging port
Micro USB 2.0
Other
Announced
2012, July


Based on our experience, we made a selection of the most common malfunctions of mobile devices and evaluated the difficulty of performing repairs for each of them. The final evaluation of the difficulty of the repair is the sum of all the parameters. This difficulty rating is also applicable for all models Philips Xenium W732 released for markets in different countries.

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