General characteristics Xiaomi Mi 8 SE declared by the manufacturer. The high-resolution pictures of the motherboard and electronic components.


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Technical review Xiaomi Mi 8 SE

Main and additional circuit boards Xiaomi Mi 8 SE

Side 1
Side 2
Characteristics
Features
Type
Smartphone
OS
Android 8.1 (Oreo)
SIM type/size
Nano SIM
SIM
Dual SIM
Dimensions
147.3 x 73.1 x 7.5 mm (5.80 x 2.88 x 0.30 in)
Weight
164 g (5.78 oz)
Display
Display type
Super AMOLED
Size
5.88 inches
Resolution
1080 x 2244 pixels, 18.7:9 ratio
PPI density
423
Protection
Corning Gorilla Glass 5
Multimedia
Main camera
12 MP/ 5 MP
Main camera Video
2160p, 30fps
Front (selfie) camera
20 MP
Front (selfie) camera Video
1080p, 30fps
Audio
MP3, AAC, WAV, WMA
Headphone jack
Mini jack 3.5 mm
Network
Technology
GSM/ 3G/ 4G LTE
LTE
Band 1, 3, 5, 7, 8, 34, 38, 39, 40, 41
Interfaces
Wi-Fi 802.11n, Bluetooth 5.0
Satellite navigation
GPS with A-GPS, GLONASS, BDS, GALILEO
Processor and Memory
System on a chip
Qualcomm SDM710 Snapdragon 710
CPU
Octa-core 2x 360 Gold 2.2 GHz + 6x Kryo 360 Silver 1.7 GHz
GPU
Adreno 616
Internal memory
128 GB
RAM
6 GB
Card slot
No
Battery
Battery capacity
Li-Po 3120 mAh
Charging port
USB Type-C
Other
Announced
2018, May

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Based on our experience, we made a selection of the most common malfunctions of mobile devices and evaluated the difficulty of performing repairs for each of them. The final evaluation of the difficulty of the repair is the sum of all the parameters. This difficulty rating is also applicable for all models Xiaomi Mi 8 SE released for markets in different countries.



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