It depends on what heating surface you mean.
If it is used for not very strong heating of the device, for gluing the back cover or gluing the display, then there is no particular difference, only the size of the heated surface matters. Tablets can be up to 12 inches in size or it is necessary to heat several devices at the same time.
If you mean equipment for soldering boards, then you need to choose a model with more precise temperature control and minimal deviation of values, since this is very important for complex soldering.
yes but what i mean is if there is a good thermal compound or is it intended to avoid the outside to be to hot?, normally companies try to avoid the outside to be uncomfortable hot, and I noticed that the cpu overheads very quick while playing 3d games and the fps drops to compensate.
so since you have opened, i asked so i dont need to open it if there is no way to improve the cooling, like for example if there is an isolation layer, getting rid of it, or if there is a thick thermal pad, since it is very bad, using copper to fill the gap with ptm to disipate quicker the heat
no no, ok, from the beginning, while playing games, the pad 6 is barely warm on the outside but the CPU goes over 70 and thermothrotles, so the back tape in the indise over the aluminium case where the soc is, is that an isolation?
I already tried adding cooling but the effect is not to great, is like there is a poor thermal transfer to the back, that is way I asked, to open it and mod it to allow the heat to be transfer to the case
Alexander Paniagua Spind…
2025-01-10Alexander Paniagua Spind…
2025-01-10